Files
rebbarb/hardware/re-bba-rb/TODO.md
T
Roflin 530f41cf7a Add FT2232H EEPROM interface resistors per datasheet Table 3.4
The 93LC46B's DO and DI were both tied directly to EEDATA, causing
drive contention during EEPROM read turnaround. Per the FT2232H
datasheet ("Connect directly to Data-In of the EEPROM and to Data-Out
of the EEPROM via a 2.2K resistor. Also, pull Data-Out of the EEPROM
to VCC via a 10K resistor"):

- U7.4 (DO) moved onto new net EE_DO
- R30 2.2k (UNI-ROYAL 0402WGF2201TCE, LCSC C25879, Basic) between
  EE_DO and EE_DATA
- R31 10k (0402WGF1002TCE, C25744) pull-up from EE_DO to 3V3
- EEDATA -> DI (U7.3) stays direct

Schematic only; R30/R31 still need placing near U7 in the PCB rework.
Verified: ERC 0, EE_DATA = {U8.61, U7.3, R30.2}, EE_DO = {U7.4, R30.1,
R31.2}, R31.1 on global /Power/3V3 (no orphan local net), netlist
115 vs BOM 114 differing only by the deliberate J3 exclusion.

Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
2026-07-18 12:51:54 +00:00

12 KiB
Raw Blame History

re-bba-rb board — open items from hardware review (2026-07-17)

Full review of schematics + PCB against component datasheets (datasheets/ — restore from commit db457a0, see Housekeeping), the WIZnet W5100S reference schematic, and JLCPCB manufacturing limits. ERC/DRC: clean.

Critical — must fix before (or with) next fab

  • EXI DO/DI swapped at J3 — FIXED 2026-07-17 (all copper unchanged). YAGCD SP1 naming is console-perspective: pin 6 DO = GC data out → adapter's MOSI input; pin 9 DI = GC data in ← adapter's MISO output (verified via SD Gecko: MC pin 5 DO → SD CMD input; SD2SP2: DO → OR gate → SD CMD). Fix applied as a pure rename/identity swap: - [x] SP1 pin table in docs/gc_bba_fpga_design.md corrected (was the root cause) + MISO-tristate note updated. - [x] Net names EXI_MOSI(_RAW) ↔ EXI_MISO(_RAW) swapped across exi.kicad_sch, Fpga.kicad_sch, root sheet, and the PCB — this also swaps the D2 (PUSB3AB6) channel assignments by name. - [x] R21 (22 Ω) ↔ R25 (33 Ω) identities swapped between the two positions so 33 Ω stays on the FPGA-driven MISO line and 22 Ω on the MOSI input. - [x] Verified: ERC 0, DRC 0 (incl. schematic parity 0), netlist: J3.6(DO)→R21(22Ω)→FPGA pin 4 (IOB_8a) = EXI_MOSI in; J3.9(DI)→R25(33Ω)→FPGA pin 3 (IOB_9b) = EXI_MISO out. - [ ] Use this final pin map when writing the board PCF (see Broader items): MOSI = pin 4, MISO = pin 3, CLK = 44 (G6), CS = 45, INT = 46.
  • W5100S MDI termination network (ethernet.kicad_sch) — schematic part DONE 2026-07-17: added R26/R27 (49.9 Ω 1%, LCSC C25120) from TXOP/TXON to a common node + C18 (100 nF) to GND, and R28/R29 + C19 for RXIP/RXIN, on the PHY-side nets per the WIZnet reference schematic. ERC 0; netlist verified. Remaining (PCB rework): - [ ] Place the 6 new footprints (Update PCB from Schematic / F8 pulls them in) next to U11 pins 2/3/5/6 — WIZnet: "place the 49.9 resistors and 0.1uF capacitor near the MDI pin of W5100S". - [ ] Keep the pair stubs to the resistors short; the ETH_DP netclass width/gap rules still apply to the through-line. - [ ] Optional (left out deliberately): 3.3 Ω series damping resistors in each line (WIZnet note 6, EMI reduction) — would require breaking the pairs; add only if EMI testing demands. - [ ] Place C51/C52 physically at J2 pins 4/5 (center taps). - [ ] Reconsider D4/D5 (USBLC6 on the line side of the magnetics): unusual — transformer already isolates; their VBUS pins float so they only clamp to GND. Remove or justify.
  • FT2232H EEPROM interface (Usb Connector.kicad_sch) — schematic part DONE 2026-07-17 per datasheet Table 3.4: U7.4 (DO) moved to new net EE_DO; R30 (2.2 kΩ, C25879) inserted EE_DO→EE_DATA; R31 (10 kΩ, C25744) pull-up EE_DO→3V3. EEDATA→DI stays direct. ERC 0, netlist verified, BOM fields populated. Remaining (PCB rework): - [ ] Place/route R30 + R31 near U7 (Update PCB from Schematic pulls them in together with the 6 MDI termination parts — 8 new footprints total).

Functional / robustness

  • iceprog pin mismatch: iceprog hardcodes CS=ADBUS4, CDONE=ADBUS6, CRESET=ADBUS7. Board uses FLASH_CS=ADBUS3, CDONE=ACBUS1, CRESET=ACBUS0. Rewire to the iCEbreaker convention, or maintain a patched iceprog.
  • TPS2116 PR1 divider margin: 200k/100k gives PR1 = 1.10 V vs VREF = 1.0 V ±8 % (max 1.08 V) — 20 mV worst-case margin against the 3.3 V buck output. Change R3 to 150 k → switchover at 2.302.70 V.
  • ETH_RST pull-up: W5100S RSTn is a plain input (no internal pull) and floats while the FPGA configures. Add 10 k to ETH_3V3 (not 3V3, so it sits low when the ETH rail is off).
  • Gateware: gate all outputs on GC_ON — when GC_ON=0 the W5100S is unpowered (U12) and the GC is off, but FPGA banks stay at 3.3 V. Hold the W5100S bus and EXI outputs Hi-Z/low to avoid back-powering.
  • Gateware: UART crossover — net names are FT-perspective (UART_TXD = FTDI output = FPGA RX on pin 18). Get this right in the board PCF.
  • Gateware: EXI INT drive style — prefer open-drain emulation (drive low / release) on J3.3 rather than push-pull high.

Broader items (beyond the wiring review — block fab on the first two)

  • Write the re-bba-rb pin constraintsexi_bba/synth.py still targets the iCEbreaker. This board: EXI on FPGA pins 3 (IOB_9b), 4 (IOB_8a), 44 (EXI_CLK, G6), 45 (EXI_CS), 46 (EXI_INT); W5100S bus on the IOT bank (2343); CLK12 on 20 (G3); GC_ON on 21; ETH_RST on 2; UART on 18/19. This is where the DO/DI swap and the UART crossover (UART_TXD = FTDI output = FPGA RX) get resolved. Pure software; do it before ordering to prove the pinout.
  • Add debug provisions — the board currently has none. RGB02 are unconnected, no LEDs, no button, no test points; the CLAUDE.md bring-up plan (StatusPanel heartbeat/activity LEDs + BTN re-init) has nothing to drive. Spare IOBs: 6, 9, 10, 11, 12, 13, 47, 48. Add ≥2 LEDs (heartbeat, EXI activity), a 46 pin debug header (logic-analyzer access — EXI CLK/CS/MOSI/MISO are what you probe when enumeration fails), and test points on 3V3 / 1V2 / ETH_3V3 / GC_ON. Cannot be retrofitted.
  • Verify mechanical fit — outline + finger geometry vs SP1ETH/ETH2SP1 references (per CLAUDE.md), RJ45 and USB-C protrusion vs the GC serial port bay opening. An earlier commit says "need to remeasure PCB outline"; sp1_test_plug validates pads only, not the envelope.
  • SP1 12 V rail viability — VERIFIED against existing projects (2026-07-17). webhdx's IDE-EXI v2 for Serial Port 1 (which became the commercial M.2 Loader): "New switching power regulator supplies 3.3V@2A from 12V rail" (webhdx, gc-forever thread t=4843, 2021-08-28) — a shipping SP1 product powers an M.2 SATA SSD + RP2040 entirely from pin 5's 12 V through a buck, no external supply. That's the same architecture as this board at several times our load (~130 mA @ 12 V). webhdx moved from a linear regulator to a buck because the linear "was generating a lot of heat" — validating the TPS562201 choice. The official modem (DOL-014) was the original 12 V consumer; SP1ETH leaves 12 V unused (runs from the 3.3 V pins). Remaining bench check only: - [ ] inrush into C65 (100 µF) + 2×10 µF buck input caps at GC power-on (the M.2 Loader precedent suggests this is a non-issue).
  • Decide FT2232H EEPROM contents + flashing workflow — blank 93LC46B enumerates with default VID/PID (works, generic); custom VID/PID/serial/product string needs FT_PROG provisioning. Tied to the iceprog-pin-mapping decision above (changes the schematic).
  • CC1/CC2 have no ESD protection (USBLC6 covers D+/D only) — optional, most hobby designs skip; note spare-channel budget if respinning D2 area.
  • Ensure hardware/re-bba-rb/.history/ (contains an embedded .git) is gitignored and never committed.

Minor / BOM

  • RSET_BG: datasheet says 12.3 kΩ 1 % (ref schematic: 12 k + 300 Ω); board has 12.4 k (~0.8 % off). Match if convenient.
  • Crystals Y1/Y2 — VERIFIED 2026-07-17: the BOM parts are both CL = 12 pF (Y1 YXC X322512MOB4SI / C70565, Y2 X322525MOB4SI / C9006, both JLC Basic, ±10 ppm) — correct for the 18 pF load caps and the W5100S Table 9 recommendation. No change needed.
  • 12 V-rail parts ≥ 25 V rating: C3, C4 (10 µF 0805), C6, C65 (100 µF electrolytic); D3 SMAJ12A already correct.
  • 1 % tolerance required: R1/R2 (buck VFB divider, TI requirement), R10 (FTDI REF 12 k), R16 (RSET_BG), R3/R4 (PR1 divider).
  • TPS22810 CT: floating = fastest ramp (~0.7 A inrush into ETH rail caps). Consider CT = 10 nF footprint (DNP-able).
  • Verify HR911105A internal LED pinout (assumed: 9/12 anodes via R14/R15 330 Ω to ETH_3V3, 10/11 cathodes to LNKn/ACTn) and the Bob-Smith common on pin 8 (tied straight to GND here; WIZnet ref separates chassis via 1 nF/2 kV — acceptable choice, confirm intent).
  • Confirm at bring-up (from CLAUDE.md): W5100S register addresses / MR bits were written from memory.

JLCPCB ordering notes (DRC clean — these are order-form options)

  • Stackup = JLC04121H-7628 (matches the 0.2104 mm prepreg / 0.6 mm core, ~1.14 mm ≙ JLC nominal 1.2 mm — satisfies the SP1 slot's 1.2 mm spec).
  • Select ENIG (file has copper_finish "None") and gold fingers + 45° bevel for the SP1 edge connector.
  • Hand-solder / non-economic-assembly parts: C65 (THT electrolytic), J2 magjack (THT), J1 USB-C, D2 (DFN2111-7, tiny). Plan assembly split.
  • LCSC part numbers — COMPLETE 2026-07-17: all 112 orderable components have Footprint + Value + MPN + LCSC + Manufacturer (netlist-vs-BOM count check passes; the only netlist/BOM delta is J3, deliberately excluded from BOM since the SP1 edge connector is PCB gold fingers, not a part). 12 V-rail caps verified ≥25 V, divider/REF/RSET resistors verified 1 %. Note: D2 is the ElecSuper PUSB3AB6Z(ES) clone (C49383400, Extended), not Nexperia — same DFN-7 1.1×2.1 / 0.15 pF; pin-compatible, but treat as a bring-up suspect if EXI ESD behaviour looks odd. C65 is an SMD electrolytic (Lelon VZH101M1ETR-0607, 25 V) — assembly-friendly, not THT as first assumed.
  • Check fiducials for SMT assembly.

Housekeeping (repo) — done 2026-07-17

  • Restored hardware/re-bba-rb/datasheets/ (deleted by 3547302) from the LFS store; added TPS22810 (power/) and PUSB3AB6 (exi/) datasheets that were missing from the original set.
  • Deleted stale lowercase power.kicad_sch (the pre-rework draft from the first power-sheet commit; live sheet is Power.kicad_sch). It "kept coming back" because both paths were git-tracked: on a case-insensitive (Windows) checkout they are one file on disk, so deleting one path also deletes the other, and restoring the live sheet re-materialises both — the next commit resurrects the stale path. Removing the lowercase path from the git index (done from the case-sensitive devcontainer) is the permanent fix. Never add two files differing only in case.
  • Deleted re-bba-rb.kicad_pcb.old.kicad_pcb / .old.kicad_pro leftovers (recoverable from git history if ever needed).

Verified correct — do not re-flag

TPS562201 (EN at 12 V legal, abs max 19 V; 0.768 V ref × 33k/10k = 3.30 V; L/C per Table 7-2) · TPS2116 mode/ST logic (GC priority, USB fallback, GC_ON polarity) · AP2112K ×2 · TPS22810 EN (never floats, R5 pull-up) · FT2232H VPHY/VPLL on 3.3 V is correct per datasheet (the VCORE→3V3 relabel at HEAD was a fix) · W5100S parallel-mode straps (MOD=0100, SCLK→GND, pin32=A0/pin33=A1, INTn push-pull, internal pull-ups on CSn/RDn/WRn/DAT) · W5100S 1V2 loop + mandatory 1 MΩ crystal feedback · PUSB3AB6 pinout/footprint · USB-C CC/ESD wiring · iCE40 power/config/flash, CLK12 on G3, EXI_CLK on G6 · magjack transformer spec (1:1, 350 µH) · PCB vs JLCPCB capability floor (rules in re-bba-rb.kicad_dru, 0 DRC errors).