Fixes review comments.
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@@ -206,6 +206,30 @@ Major work this session:
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at (148.49, 61.7225) near U11 pin 48. Verified 2026-07-22: nets
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`/ethernet/ETH_RST` + `/ethernet/ETH_3V3` both present on the footprint,
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0 unconnected items.
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- [ ] **12 V inrush limiter (U13 TPS25961 eFuse) — SCHEMATIC DONE 2026-07-31**,
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full design rationale in REVIEW.md §6. J3.5 → 12V_RAW → U13 → 12V_EXI;
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D3 (TVS) stays upstream, C65 downstream. R45 100 k sets I_LIM ≈ 500 mA
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(caps inrush, 3.8× the ~130 mA steady-state load); R46/R47 620 k/100 k
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set UVLO ≈ 8.9 V; C66 100 nF is Cin. U13 = TPS25961DRVR, **LCSC
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C5571272**.
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- [ ] **PCB: place + route U13, R45, R46, R47, C66.** Two datasheet
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requirements to honour in layout: (1) the **thermal pad must
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connect to the GND plane** — the footprint is the `_ThermalVias`
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variant, confirm the vias actually reach In1/In2 GND; (2) **OVLO
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absolute max is 6.5 V** and it is tied to GND for the internal
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fixed threshold — that connection must be solid and must never
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see 12 V. Keep C66 close to U13's IN pin.
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- [ ] **Select parts for R45 (100 k), R46 (620 k), R47 (100 k), C66
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(100 nF)** — fields intentionally left blank. R45/R47 can reuse
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the UNI-ROYAL 100 k C25741 already used by R4 (NOT C60490 - that part
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is 10 k, an earlier note in this file had it wrong).
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**Do not round R45 into 58.8–66.7 kΩ, 111–142 kΩ or 250–500 kΩ**
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(datasheet Table 7-1 forbidden ON-resistance bins).
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- [ ] **Bench: verify inrush at GC power-on** — expect ≈500 mA for
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~2.9 ms (was ~621 mA slew-limited, unbounded before the eFuse).
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Also confirm no retry/motorboating at startup; if the rail sags
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more than expected, that points at SP1 connector/cable impedance,
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not the UVLO setting.
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- [ ] **Gateware: gate all outputs on GC_ON** — when GC_ON=0 the W5100S is
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unpowered (U12) and the GC is off, but FPGA banks stay at 3.3 V. Hold
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the W5100S bus and EXI outputs Hi-Z/low to avoid back-powering.
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@@ -327,10 +351,21 @@ Major work this session:
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WIZnet's own reference synthesizes it as 12 k + 300 Ω. The 0.8 %
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deviation on a bandgap bias resistor is immaterial (well under the
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combined tolerance of the ref design's two 1 % parts).
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- [x] Crystals Y1/Y2 — VERIFIED 2026-07-17: the BOM parts are both CL = 12 pF
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(Y1 YXC X322512MOB4SI / C70565, Y2 X322525MOB4SI / C9006, both JLC
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Basic, ±10 ppm) — correct for the 18 pF load caps and the W5100S
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Table 9 recommendation. No change needed.
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- [x] Crystals Y1/Y2 — VERIFIED 2026-07-17, **RE-CONFIRMED 2026-07-31**: the
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BOM parts are both CL = 12 pF (Y1 YXC X322512MOB4SI / C70565,
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Y2 X322525MOB4SI / C9006, both JLC Basic, ±10 ppm) — correct for the
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18 pF load caps (`CL = C/2 + Cstray` → 18/2 + 3 = 12 pF exactly).
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**This entry was right; a 2026-07-31 attempt to change the caps to
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30 pF/10 pF was a regression and has been reverted.** The cause was
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wrong `CL` metadata in the schematic symbol properties (Y1 said 18 pF,
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Y2 said 8 pF) — properties are now corrected to the real specs from
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`datasheets/Ysx321SL.pdf`. Do not change the crystal caps.
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Note: the "W5100S Table 9 recommendation" citation above is fragile —
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Table 9 says 12 pF but **Table 8 says 8 pF**, and the DS revision
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history logs "Modified Load capacitance value (12p → 8p)". The fitted
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12 pF part therefore matches the *stale* table. Accepted as a
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documented deviation (frequency accuracy unaffected; gain margin 7.75×
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with R44) — see REVIEW.md §5.
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- [x] 12 V-rail parts ≥ 25 V — VERIFIED in BOM audit 2026-07-17: C3/C4 25 V,
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C6 50 V, C65 25 V (Lelon SMD electrolytic); D3 SMAJ12A correct.
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- [x] 1 % tolerance — VERIFIED in BOM audit 2026-07-17: R1/R2, R3/R4, R10,
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@@ -346,6 +381,19 @@ Major work this session:
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separates chassis via 1 nF/2 kV — acceptable choice, confirm intent).
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- [ ] Confirm at bring-up (from CLAUDE.md): W5100S register addresses / MR
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bits were written from memory.
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- [ ] **Measure Y2 crystal drive level at bring-up and tune R44 (RExt).**
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Added 2026-07-31 at **49.9 Ω** (gain margin 7.53×, DS requires ≥5;
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**ceiling 100 Ω**, 120 Ω fails startup). Reason it exists: the fitted
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crystal is rated **DL = 200 µW max** but W5100S Table 9 says select a
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**500 µW** part, so the chip can overdrive it ~2.5×. Part fields are
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deliberately blank — confirm the value on the bench (scope the crystal,
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compute DL) before committing a BOM line. If drive is comfortably under
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200 µW a smaller value (or 0 Ω, per the WIZnet reference) is fine; if
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it's high, go up but stay ≤100 Ω. See REVIEW.md §5.
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- [ ] **Select a part for R43** (EE_CS 10 kΩ pull-down, added 2026-07-31).
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Any 10 kΩ 0402 works — the in-stock YAGEO RC0402FR-0710KL / C60490
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already used on R2/R5/R18/R31/R36 is the obvious choice; fields were
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left blank so it doesn't silently inherit an out-of-stock part.
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## JLCPCB ordering notes (DRC clean — these are order-form options)
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