docs: correct stale 'part fields blank' notes + flag kicad-cli zone-refill DRC trap
All eFuse/RExt/EE-CS parts (U13, R43-R47, C66, R44, D13) are picked with MPN+LCSC in the live BOM and placed+routed on the PCB - the TODO/REVIEW notes calling their fields 'intentionally blank' were written when the parts were first added and never updated. Corrected to reflect the committed state. Also documents the kicad-cli DRC gotcha that caused a false alarm: it does not refill zones, so it reports phantom GND-via-in-3V3-pour and thermal-pad clearance errors (actual 0.000mm) on a board the GUI reports clean. Added a warning at the top of TODO and in REVIEW section 7 so no future session mistakes it for a real defect. Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
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@@ -195,9 +195,10 @@ datasheet extraction, WebSearch/WebFetch for parts and reference designs.
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(F=25 MHz, ESR=50 Ω per the 16–31 MHz band, C0=3 pF max, CL=12 pF,
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(F=25 MHz, ESR=50 Ω per the 16–31 MHz band, C0=3 pF max, CL=12 pF,
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gm=16.7 mA/V): **margin 7.53×**, against a DS requirement of ≥5 (the
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gm=16.7 mA/V): **margin 7.53×**, against a DS requirement of ≥5 (the
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"6.99 dB" in Table 8 is 10·log₁₀5). **Ceiling is 100 Ω** — 120 Ω already
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"6.99 dB" in Table 8 is 10·log₁₀5). **Ceiling is 100 Ω** — 120 Ω already
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fails the startup spec. Fitted value is a starting point; part fields are
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fails the startup spec. Part is PICKED (UNI-ROYAL 0402WGF4999TCE, C25120 —
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intentionally blank so it is re-selected/confirmed at bring-up by
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the same 49.9 Ω already on R26–R29); the 49.9 Ω value is still a starting
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measuring drive level.
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point to **confirm at bring-up** by measuring drive level (bench action
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only — the BOM line is not blank).
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- **Crystal symbol properties corrected 2026-07-31** (they were metadata-only
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- **Crystal symbol properties corrected 2026-07-31** (they were metadata-only
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errors, no copper impact, but they caused the regression above):
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errors, no copper impact, but they caused the regression above):
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Y1 CL 18 pF→**12 pF**, ESR 50 Ω→**80 Ω** (DS band 12–15 MHz),
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Y1 CL 18 pF→**12 pF**, ESR 50 Ω→**80 Ω** (DS band 12–15 MHz),
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@@ -342,10 +343,19 @@ datasheet extraction, WebSearch/WebFetch for parts and reference designs.
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## 7. PCB global / JLCPCB — REVIEWED, PASS
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## 7. PCB global / JLCPCB — REVIEWED, PASS
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- **DRC**: 0 errors / 0 unconnected / 0 parity as of each review point
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- ⚠️ **`kicad-cli pcb drc` DOES NOT REFILL ZONES — do not panic at its output.**
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(remaining parity items = the 11 debug/fix footprints awaiting placement +
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It evaluates the zone-fill state *as saved in the file*, so any GND stitching
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3 FTDI reroutes + R3 value sync — all listed by F8). Warnings are
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via sitting in the 3V3 pour, or a thermal pad in the GND pour, is reported as
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silkscreen cosmetics only (~150; JLC auto-clips).
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a phantom `clearance`/`hole_clearance` error with "actual 0.0000 mm" — because
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the saved fill still has copper where the GUI would carve a void. **The KiCad
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GUI refills all zones before DRC**, so the GUI (the authority) shows these
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clean. Confirmed 2026-08-02: a command-line DRC reported 18 such
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"errors" (14 GND-vias-over-3V3, 4 on U13's thermal pad) on a board the GUI
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reports clean. If you must DRC from the CLI, open the board in the GUI, run
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"Fill All Zones" (B), save, THEN run `kicad-cli` — or just trust the GUI.
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The board is DRC-CLEAN in KiCad.
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- **DRC (GUI, authoritative)**: 0 errors / 0 unconnected / 0 parity. Warnings
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are silkscreen cosmetics only (~150–170; JLC auto-clips).
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- **JLC capability floor**: encoded as error-severity rules in
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- **JLC capability floor**: encoded as error-severity rules in
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`re-bba-rb.kicad_dru` (0.09 mm trace/space, 0.15 mm drill, 0.2 mm
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`re-bba-rb.kicad_dru` (0.09 mm trace/space, 0.15 mm drill, 0.2 mm
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hole-to-copper etc.) — passing. Diff-pair impedance rules (USB 90 Ω,
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hole-to-copper etc.) — passing. Diff-pair impedance rules (USB 90 Ω,
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+45
-35
@@ -1,5 +1,16 @@
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# re-bba-rb board — open items from hardware review (2026-07-17)
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# re-bba-rb board — open items from hardware review (2026-07-17)
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> **Status 2026-08-02:** board is **DRC-clean in the KiCad GUI and all BOM
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> parts are picked** (eFuse U13 + R43–R47/C66, RExt R44, EE_CS R43, D13, all
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> verified present with MPN+LCSC in the live schematic/PCB). ⚠️ **Do not trust
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> `kicad-cli pcb drc` blindly** — it does not refill zones and will report
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> phantom GND-via-in-3V3-pour / thermal-pad clearance "errors" (actual 0.000 mm)
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> that the GUI resolves on refill. See REVIEW.md §7. The per-session DRC counts
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> quoted lower in this file predate the 2026-07-31 eFuse work; the GUI is the
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> authority and it is clean. Remaining work is bench/verification + JLC
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> order-form options, not schematic/PCB defects.
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Full review of schematics + PCB against component datasheets (in
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Full review of schematics + PCB against component datasheets (in
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`datasheets/`), the WIZnet W5100S reference schematic, and JLCPCB
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`datasheets/`), the WIZnet W5100S reference schematic, and JLCPCB
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manufacturing limits. Status 2026-07-18: **all three critical findings fixed
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manufacturing limits. Status 2026-07-18: **all three critical findings fixed
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@@ -40,15 +51,16 @@ Major work this session:
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driven directly by the FPGA's `SB_RGBA_DRV` hard macro, no series resistor)
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driven directly by the FPGA's `SB_RGBA_DRV` hard macro, no series resistor)
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need no resistor change — flagged as slightly reduced current-source
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need no resistor change — flagged as slightly reduced current-source
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headroom at the higher Vf, not fixed (nothing to fix, no resistor exists).
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headroom at the higher Vf, not fixed (nothing to fix, no resistor exists).
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- [ ] **D13 (yellow, Everlight C72038) and the 10 kΩ 0402 resistor
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- [x] **D13 and the 10 kΩ resistor — COMMITTED in the live BOM**
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(UNI-ROYAL C25744, used by 12 designators) are ALSO reported out of
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(verified 2026-08-02): D13 = Hubei KENTO **KT-0603Y (C2287)**; the
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stock** — real in-stock alternatives were being researched
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10 kΩ 0402 = UNI-ROYAL 0402WGF1002TCE **C25744** (R43 and others).
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(candidates: Hubei KENTO KT-0603Y/KT-0805Y for D13; YAGEO
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These are the chosen parts, no longer unresolved.
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RC0402FR-0710KL C60490 or Vishay CRCW040210K0FKED C71617 for the
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- [ ] Standard order-time step (not a blocker, applies to the whole
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10k) but never confirmed/committed — stock claims from web search
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BOM): do a **live JLCPCB stock check** just before ordering —
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proved unreliable earlier this session (contradicted by direct
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earlier web-search stock claims proved unreliable, so trust
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JLCPCB part-page checks twice), so these need a live stock check
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only the JLCPCB part page at order time. C2287 and C25744 were
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before ordering, same as the green LED did.
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the out-of-stock scares that prompted this note; re-confirm them
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specifically.
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- **J5 added**: a second SP1 gold-finger connector, footprint copied from
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- **J5 added**: a second SP1 gold-finger connector, footprint copied from
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the eth2sp1 open-source project (github.com/jochemvdmeulen/eth2sp1),
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the eth2sp1 open-source project (github.com/jochemvdmeulen/eth2sp1),
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library file `hardware/SP1_eth2sp1_reference.kicad_mod`. Real purpose:
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library file `hardware/SP1_eth2sp1_reference.kicad_mod`. Real purpose:
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@@ -212,19 +224,19 @@ Major work this session:
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(caps inrush, 3.8× the ~130 mA steady-state load); R46/R47 620 k/100 k
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(caps inrush, 3.8× the ~130 mA steady-state load); R46/R47 620 k/100 k
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set UVLO ≈ 8.9 V; C66 100 nF is Cin. U13 = TPS25961DRVR, **LCSC
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set UVLO ≈ 8.9 V; C66 100 nF is Cin. U13 = TPS25961DRVR, **LCSC
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C5571272**.
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C5571272**.
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- [ ] **PCB: place + route U13, R45, R46, R47, C66.** Two datasheet
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- [x] **PCB: U13, R45, R46, R47, C66 placed + routed** (verified on disk
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requirements to honour in layout: (1) the **thermal pad must
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2026-08-02: U13 at 206.99,48.47 with R45/R46/R47/C66 clustered
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connect to the GND plane** — the footprint is the `_ThermalVias`
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around it; 0 unconnected items board-wide). Two datasheet
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variant, confirm the vias actually reach In1/In2 GND; (2) **OVLO
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requirements honoured in layout: (1) the **thermal pad connects to
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absolute max is 6.5 V** and it is tied to GND for the internal
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the GND plane** — footprint is the `_ThermalVias` variant; (2)
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fixed threshold — that connection must be solid and must never
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**OVLO absolute max 6.5 V** tied to GND for the internal fixed
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see 12 V. Keep C66 close to U13's IN pin.
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threshold. Keep this arrangement.
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- [ ] **Select parts for R45 (100 k), R46 (620 k), R47 (100 k), C66
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- [x] **Parts for R45/R46/R47/C66 — PICKED** (verified in live BOM
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(100 nF)** — fields intentionally left blank. R45/R47 can reuse
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2026-08-02): R45/R47 = UNI-ROYAL 100 k **C25741**, R46 = YAGEO
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the UNI-ROYAL 100 k C25741 already used by R4 (NOT C60490 - that part
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620 k RC0402FR-07620KL **C137952**, C66 = 100 nF **C1525**.
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is 10 k, an earlier note in this file had it wrong).
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R45 = 100 k is clear of the forbidden ON-resistance bins
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**Do not round R45 into 58.8–66.7 kΩ, 111–142 kΩ or 250–500 kΩ**
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(58.8–66.7 kΩ, 111–142 kΩ, 250–500 kΩ) — do not "round" it into
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(datasheet Table 7-1 forbidden ON-resistance bins).
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them if ever re-selected.
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- [ ] **Bench: verify inrush at GC power-on** — expect ≈500 mA for
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- [ ] **Bench: verify inrush at GC power-on** — expect ≈500 mA for
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~2.9 ms (was ~621 mA slew-limited, unbounded before the eFuse).
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~2.9 ms (was ~621 mA slew-limited, unbounded before the eFuse).
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Also confirm no retry/motorboating at startup; if the rail sags
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Also confirm no retry/motorboating at startup; if the rail sags
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@@ -381,19 +393,17 @@ Major work this session:
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separates chassis via 1 nF/2 kV — acceptable choice, confirm intent).
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separates chassis via 1 nF/2 kV — acceptable choice, confirm intent).
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- [ ] Confirm at bring-up (from CLAUDE.md): W5100S register addresses / MR
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- [ ] Confirm at bring-up (from CLAUDE.md): W5100S register addresses / MR
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bits were written from memory.
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bits were written from memory.
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- [ ] **Measure Y2 crystal drive level at bring-up and tune R44 (RExt).**
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- [ ] **Measure Y2 crystal drive level at bring-up and tune R44 (RExt) if
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Added 2026-07-31 at **49.9 Ω** (gain margin 7.53×, DS requires ≥5;
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needed.** Fitted at **49.9 Ω** (part PICKED: UNI-ROYAL 0402WGF4999TCE
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**ceiling 100 Ω**, 120 Ω fails startup). Reason it exists: the fitted
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**C25120**, verified in live BOM 2026-08-02). Gain margin 7.53× (DS
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crystal is rated **DL = 200 µW max** but W5100S Table 9 says select a
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requires ≥5; **ceiling 100 Ω**, 120 Ω fails startup). Reason it exists:
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**500 µW** part, so the chip can overdrive it ~2.5×. Part fields are
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the fitted crystal is rated **DL = 200 µW max** but W5100S Table 9 says
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deliberately blank — confirm the value on the bench (scope the crystal,
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select a **500 µW** part, so the chip can overdrive it ~2.5×. Only a
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compute DL) before committing a BOM line. If drive is comfortably under
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bench action remains: scope the crystal, compute DL; if comfortably under
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200 µW a smaller value (or 0 Ω, per the WIZnet reference) is fine; if
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200 µW a smaller value (or 0 Ω per the WIZnet reference) is fine, if high
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it's high, go up but stay ≤100 Ω. See REVIEW.md §5.
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go up but stay ≤100 Ω. See REVIEW.md §5.
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- [ ] **Select a part for R43** (EE_CS 10 kΩ pull-down, added 2026-07-31).
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- [x] **R43 part PICKED** (EE_CS 10 kΩ pull-down): UNI-ROYAL 0402WGF1002TCE
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Any 10 kΩ 0402 works — the in-stock YAGEO RC0402FR-0710KL / C60490
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**C25744** (verified in live BOM 2026-08-02). No action remains.
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already used on R2/R5/R18/R31/R36 is the obvious choice; fields were
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left blank so it doesn't silently inherit an out-of-stock part.
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## JLCPCB ordering notes (DRC clean — these are order-form options)
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## JLCPCB ordering notes (DRC clean — these are order-form options)
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