The TPS25961's exposed pad is GND and the datasheet requires it be connected
to the GND plane (Table 5-1; package note 3 adds a mechanical requirement).
REVIEW.md claimed this was honoured because the footprint is the _ThermalVias
variant -- but the variant alone connects nothing. hardware/TPS25961.kicad_sym
defined pins 1-6 only, with no pin for the exposed pad, so KiCad had nothing to
map onto footprint pad 7 and left it netless: an isolated copper island under
the chip with its thermal vias going nowhere.
Adds pin 7 (GND, power_in, hidden, stacked on pin 4) to the symbol library, the
cached symbol in exi.kicad_sch, and the U13 instance.
PCB updated and verified: U13 pad 7 carries GND on all four elements (both SMD
rects and both thermal vias), R48 placed, EFUSE_OVLO routed, R49 gone. DRC
reports 0 violations, 0 unconnected pads and 0 schematic parity issues -- the
0-unconnected result is what confirms pad 7 is tied into the GND network rather
than merely labelled. The 4 DRC errors previously dismissed as zone-fill
phantoms on this pad are gone, though zones were refilled in the same pass so
that is not proof of cause either way.
Co-Authored-By: Claude Opus 5 <noreply@anthropic.com>
Redraws the eFuse area with proper wires instead of labels-on-pins, and
simplifies the divider that 228ff03 added.
The first draft split R3 into 12 k + 2.2 k to hit 14.2 k, purely to preserve
the original ~8.9 V UVLO. That bought a fourth resistor and a named junction
net (EFUSE_R3MID) that nothing else touched. The ~9 V UVLO turned out to be
an assumption carried over from the original design rather than a requirement:
U3's minimum input is 4.5 V, so relaxing it to 6.78 V costs nothing and is in
fact less likely to chatter if the GC rail sags.
R46 620 k -> 100 k (C25741) R1: 12V_RAW -> EN/UVLO
R47 100 k -> 12.4 k (C11692) R2: EN/UVLO -> OVLO
R48 NEW 10 k (C25744) R3: OVLO -> GND
R49 removed
R45 100 k -> 33 k (C25779) ILIM 0.52 A -> 1.52 A
OVLO is unchanged at 15.18 V typ (14.47-15.78 worst case) against U3's 17 V
limit, so the simplification costs nothing on the parameter that matters.
Verified: 12V_RAW(R46.2) / EFUSE_EN(R46.1,R47.1,U13.5) / EFUSE_OVLO(R47.2,
R48.1,U13.2) / GND(R48.2,R45.2,U13.4); 152 -> 151 components with only R49
removed; ERC 0 violations.
Co-Authored-By: Claude Opus 5 <noreply@anthropic.com>
Implements the values worked out in 6ce7657.
R45 100k -> 33k ILIM 0.52 A -> 1.52 A (clears the 621 mA inrush)
R46 620k -> 150k ladder R1: 12V_RAW -> EN/UVLO
R47 100k -> 10k ladder R2: EN/UVLO -> OVLO
R48 NEW 12k \ ladder R3 = 14.2k: OVLO -> GND
R49 NEW 2.2k /
U13 pin 2 (OVLO) taken off GND and onto the new EFUSE_OVLO net
Verified: netlist shows 12V_RAW(R46.1) / EFUSE_EN(R46.2,R47.1,U13.5) /
EFUSE_OVLO(R47.2,R48.1,U13.2) / EFUSE_R3MID(R48.2,R49.1) / GND(R49.2,R45.2,
U13.4); 150 -> 152 components with none dropped (the malformed-property trap
from the kicad-bom-edit skill); ERC 0 violations.
PCB placement and routing still to do.
Co-Authored-By: Claude Opus 5 <noreply@anthropic.com>
Works the TPS25961 fix out from the datasheet rather than from memory, and
re-solves it against resistors already on the BOM.
OVLO: TI's 3-resistor ladder (eq 7/8) -> R46 620k->150k, R47 100k->10k, new
R48 12k + R49 2.2k (=14.2k). UVLO 8.93 V typ, unchanged from today; OVLO
15.21 V typ, 15.81 V worst case. The OVLO ceiling is set by U3 (TPS562201,
4.5-17 V input), not by the eFuse -- that rules out a tempting 3-resistor
solution tripping at 17.24 V.
ILIM: R45 100k -> 33k. 0.516 A sat BELOW the board's own 621 mA inrush, so
the part entered current limiting on every power-on (-> thermal shutdown ->
retries -> latch-off). Inrush control comes from the fixed 5.17 V/ms slew
rate, not ILIM, so raising ILIM costs no inrush protection; it is pure fault
protection at ~27x the measured 56 mA load.
Every value is already stocked and 620k loses its only user: one FEWER unique
part, +2 placements.
Co-Authored-By: Claude Opus 5 <noreply@anthropic.com>
Anode-side pad at 3V3, cathode at 0V, LED dark — the full rail standing
across it means no current and no drop across R42, so Q2 and R42 are both
doing their job. Probe pressure on the anode pad lights it at full
brightness: the terminal is sitting on the pad unwetted. Reflow fixes it.
Co-Authored-By: Claude Opus 5 <noreply@anthropic.com>
From the physical V2 bring-up session (2026-09-20):
- exi_bba/w5100_selftest.py (NEW): standalone FPGA<->W5100 bus diagnostic.
Clock-independent data-bus walk (direct-mode GAR0 read-back, all 8 lines) +
MR software-reset self-clear (needs the 25 MHz crystal). Reports 4 verdicts on
D6/D7 LEDs AND over UART (115200): GOOD / data-line-N / clock-dead / no-response.
Boot wait is 85 ms (> the W5100S 60.3 ms init). On this board: GOOD -- bus +
all 8 data lines + 25 MHz clock all verified (unlike V1's broken D3).
- REVIEW.md / TODO.md: eFuse U13 OVLO is tied to GND, which on the TPS25961
selects the internal FIXED ~6 V overvoltage cutoff -- so it blocks the 12 V
rail entirely (bench-confirmed: 12V_EXI=0, GC_ON=0, W5100 unpowered). FAB-
BLOCKER for V2.1: fix with an OVLO divider (~1.1M/100k -> trip ~15 V). Bench
workaround: lift U13 pin 2 (OVLO) off GND. Also closed the eFuse-placement,
GND-via/3V3-zone, and CC-ESD TODO items.
- hardware/re-bba-rb/exi_devid_spi.py (NEW): Pi hardware-SPI (~25 MHz) EXI
device-ID host, companion to the bit-bang exi_devid_rpi.py.
Co-Authored-By: Claude Opus 4.8 <noreply@anthropic.com>
Hardware bring-up correction (Dennis, 2026-08-22): writing the FT2232H product
string to the undersized 93LC46B (U7) does NOT harmlessly fail — the partial,
mirrored write lands a checksum-valid-but-garbage config, and the FT2232H then
FAILS USB enumeration entirely (dead silent, no dmesg attach). It does NOT fall
back to ROM defaults; only a blank/checksum-invalid EEPROM does. The earlier
claim that "a bad EEPROM always falls back and still enumerates" was WRONG.
Recovery (confirmed working): power on with U7 CLK shorted to GND so the FT2232H
can't read a valid config -> forces ROM defaults -> enumerates -> then erase U7.
Updated REVIEW.md, TODO.md, the flash-re-bba-rb skill (do-not-program warning +
recovery, native-Linux troubleshooting), and flash_ftdi_eeprom.py comments/help
to state the soft-brick reality. The script already refuses the write on
mirroring detection; --force now documented as "reproduce the soft-brick".
Co-Authored-By: Claude Opus 4.8 <noreply@anthropic.com>
Devcontainer now grants libusb access to the FT2232H so iceprog (bitstream) and
pyftdi (FT2232H EEPROM) run inside the container:
- devcontainer.json: --privileged + /dev/bus/usb bind mount
- Dockerfile: sudo (NOPASSWD for vscode; USB nodes are root-owned), libusb-1.0-0,
libftdi1-2, pyftdi
Add the flash-re-bba-rb skill documenting the procedure (bitstream via best swept
seed, optional EEPROM string, troubleshooting, guardrails) and
flash_ftdi_eeprom.py (pyftdi, backup-first, dry-run default) + ftdi_eeprom.conf
value spec.
Bring-up on the repaired V1 unit: bitstream flash VERIFY OK (iceprog
build/seed4/top.bin, capture 58.36 MHz). EEPROM product string CANNOT be
programmed on V1 — U7 is a 93LC46B (128 B), too small for the FT2232H, which
needs a 93LC56B (256 B); the 128 B chip mirrors and the config write fails
verify. This overturns the old REVIEW note "93LC46B = correct for FT2232H"
(that only checked ORG, not size). Board still works blank -> ROM defaults;
iceprog + UART unaffected. Documented in REVIEW.md + TODO.md (swap U7->93LC56B
for V2); flash_ftdi_eeprom.py detects the mirroring and refuses the write.
Co-Authored-By: Claude Opus 4.8 <noreply@anthropic.com>
All eFuse/RExt/EE-CS parts (U13, R43-R47, C66, R44, D13) are picked with
MPN+LCSC in the live BOM and placed+routed on the PCB - the TODO/REVIEW
notes calling their fields 'intentionally blank' were written when the
parts were first added and never updated. Corrected to reflect the
committed state.
Also documents the kicad-cli DRC gotcha that caused a false alarm: it
does not refill zones, so it reports phantom GND-via-in-3V3-pour and
thermal-pad clearance errors (actual 0.000mm) on a board the GUI reports
clean. Added a warning at the top of TODO and in REVIEW section 7 so no
future session mistakes it for a real defect.
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
Schematic fixes (PCB placement/routing of new parts pending, F8 lists them):
- FTDI rewired to stock iceprog convention: FLASH_CS ADBUS3->ADBUS4,
CDONE ACBUS1->ADBUS6, CRESET ACBUS0->ADBUS7 (old pins NC). With a
blank 93LC46B (default 0403:6010) stock iceprog now works unmodified;
EEPROM workflow decided: ship blank, FT_PROG optional (keep VID/PID).
- TPS2116 PR1 divider: R3 200k->150k (C25755) - switchover now at
2.30-2.70V worst case instead of 20mV under the 3.3V rail.
- ETH_RST: R36 10k pull-up to ETH_3V3 (RSTn floats during FPGA config).
- Debug provisions: D6 green heartbeat LED (C72043) on FPGA pin 47,
D7 red EXI-activity LED (C2286) on pin 48, 330R C25104 series; J4
6-pin LA header (GND + DBG0-4 = pins 9/10/11/12/6, unpopulated);
TP1-TP5 test points (3V3/1V2/ETH_3V3/GC_ON/GND, in_bom no); FID1-3
fiducials placed board-only on the PCB, track-clearance checked.
- Embedded Device:LED / Connector:TestPoint / Conn_01x06 lib symbols.
Closed by analysis (no change): TPS22810 CT cap unnecessary (DS Table 2:
~98us rise at 3.3V with CT=0 -> ~0.5A inrush); RSET_BG 12.4k accepted
(12.3k is E192; WIZnet ref synthesizes it as 12k+300R; 0.8% immaterial).
Verified: ERC 0; netlist 132 vs BOM 125 differing only by the 7
deliberate in_bom=no items (J3, J4, TP1-5); LED polarity and TP rails
confirmed in netlist; PCB DRC 0 errors with fiducials placed.
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
Re-verified every open item against the current board:
- All three critical findings (DO/DI swap, MDI termination incl.
dampers + center-tap bypass, FTDI EEPROM resistors) now done in both
schematic and PCB - marked resolved with review results
- Marked verified-done: 12V cap ratings, 1% tolerances, .history
ignore, fiducial check (absent - to add with debug pass)
- Confirmed still open: ETH_RST pull-up, PR1 divider margin (R3 still
200k), RSET 12.4k vs 12.3k, TPS22810 CT, iceprog pin mapping, board
PCF, debug LEDs/test points, mechanical fit, ordering options
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
Completes the WIZnet reference schematic for the MDI section:
- R32-R35 3.3R 1% (YAGEO RC0402FR-073R3L, LCSC C137986) in series in
each MDI line per WIZnet note 6 (EMI damping). Chain per line is now
U11 pin -> 49.9R termination tap -> 3.3R -> D4/D5 flow-through -> J2.
Chip-side nets keep PHY_*; the D4/D5-side segments are renamed MDI_*
and added to the ETH_DP netclass patterns so the impedance DRC rules
police both halves.
- C20 100nF (C1525) + C21 1uF (C15849) on ETH_3V3 per WIZnet note 7 -
to be placed AT J2 pins 4/5 tapping the In2 ETH_3V3 island.
(Also carries KiCad's resave/reposition of ethernet.kicad_sch from the
rework session - netlist-identical, verified.)
Verified: ERC 0, netlist 121 components vs BOM 120 (J3-only delta),
PHY_TX_P = {U11.3, R26.1, R32.1}, MDI_TX_P = {R32.2, D4.1}, and
likewise for all four lines. PCB: 6 footprints to place (cut the lines
between termination and D4/D5 for R32-R35; C20/C21 at the jack).
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
Record the verdict so it isn't relitigated: USBLC6 is ST-rated for
Ethernet, PHY-side placement is standard practice, floating VBUS is
deliberate (3.3V-biased lines would clip against a tied rail), and the
split PHY_*/ETH_* nets force zero-stub flow-through routing - the
better ESD topology. Earlier stub/DNP suggestion withdrawn.
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
The 93LC46B's DO and DI were both tied directly to EEDATA, causing
drive contention during EEPROM read turnaround. Per the FT2232H
datasheet ("Connect directly to Data-In of the EEPROM and to Data-Out
of the EEPROM via a 2.2K resistor. Also, pull Data-Out of the EEPROM
to VCC via a 10K resistor"):
- U7.4 (DO) moved onto new net EE_DO
- R30 2.2k (UNI-ROYAL 0402WGF2201TCE, LCSC C25879, Basic) between
EE_DO and EE_DATA
- R31 10k (0402WGF1002TCE, C25744) pull-up from EE_DO to 3V3
- EEDATA -> DI (U7.3) stays direct
Schematic only; R30/R31 still need placing near U7 in the PCB rework.
Verified: ERC 0, EE_DATA = {U8.61, U7.3, R30.2}, EE_DO = {U7.4, R30.1,
R31.2}, R31.1 on global /Power/3V3 (no orphan local net), netlist
115 vs BOM 114 differing only by the deliberate J3 exclusion.
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
The BOM was already fully populated (112/113 parts with MPN+LCSC) - this
audits it against the hardware-review requirements and closes the gaps:
- J3 (SP1 edge connector) set to in_bom=no: it is PCB gold fingers, not
a purchasable part. Netlist-vs-BOM count check now differs by exactly
this one deliberate exclusion.
- Crystals verified CL=12pF (Y1 C70565, Y2 C9006, both JLC Basic) -
matches the 18pF load caps and W5100S Table 9. TODO item closed.
- 12V-rail caps verified >=25V (C3/C4 25V, C6 50V, C65 Lelon 25V SMD
electrolytic); divider/REF/RSET resistors verified 1%.
- Noted: D2 LCSC C49383400 is the ElecSuper PUSB3AB6Z(ES) clone of the
Nexperia part (same DFN-7 package, 0.15pF) - pin-compatible.
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
Per the WIZnet W5100S reference schematic (note 4: "to avoid the 100M
overshoot, place the 49.9 resistors and 0.1uF capacitor near the MDI
pin"): R26/R27 (49.9R 1%) from TXOP/TXON to a common node bypassed by
C18 (100nF) to GND, and R28/R29 + C19 likewise for RXIP/RXIN. Attached
on the PHY-side nets (chip side of D4/D5). BOM fields populated
(UNI-ROYAL 0402WGF4999TCE / LCSC C25120, Samsung CL05B104KO5NNNC /
C1525). Optional 3.3R series dampers deliberately omitted.
Schematic only - the 6 footprints still need placing/routing next to
U11 pins 2/3/5/6 (Update PCB from Schematic). DRC parity reports
exactly those 6 missing footprints and nothing else.
Verified: ERC 0, netlist 107->113 components, termination nets match
the reference topology.
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
SP1 DO/DI naming is console-perspective (verified against SD Gecko and
SD2SP2 wiring): pin 6 DO = GC data out = adapter MOSI input, pin 9 DI =
GC data in = adapter MISO output. The design doc's SP1 table had the
roles reversed and the schematic followed it, putting the FPGA's MISO
driver on the GC-driven DO line (bus contention).
Fix keeps all PCB routing identical:
- Swap net names EXI_MOSI(_RAW) <-> EXI_MISO(_RAW) across exi/Fpga/root
sheets and the PCB (also renames the D2 PUSB3AB6 channel assignments).
- Swap R21 (22R) <-> R25 (33R) identities between the two footprint
positions so 33R stays on the FPGA-driven MISO line, 22R on the MOSI
input.
- Correct the SP1 pin table + MISO-tristate note in
docs/gc_bba_fpga_design.md (root cause).
Resulting board pin map (for the future board PCF): EXI_MOSI = FPGA
pin 4 (IOB_8a, input), EXI_MISO = pin 3 (IOB_9b, output).
Verified: ERC 0, DRC 0 errors with schematic parity 0, netlist shows
J3.6(DO)->R21->pin 4 and J3.9(DI)->R25->pin 3.
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
- Remove stale lowercase power.kicad_sch (pre-rework draft; live sheet is
Power.kicad_sch). Both paths were git-tracked, which on a case-insensitive
Windows checkout makes them one file on disk - deleting the stale one also
deleted the live one, and restoring the live sheet resurrected the stale
path at the next commit. Removing the path from the index breaks the loop.
- Remove re-bba-rb.kicad_pcb.old.* leftovers (recoverable from history).
- Restore hardware/re-bba-rb/datasheets/ (deleted accidentally by 3547302)
and add the two missing datasheets: TPS22810 (power) and PUSB3AB6 (exi).
- Add hardware/re-bba-rb/TODO.md capturing the 2026-07-17 review findings
(EXI DO/DI swap, missing W5100S MDI termination, FTDI EEPROM resistors,
iceprog pin mismatch, PR1 margin, BOM/ordering notes); referenced from
CLAUDE.md.
Verified after cleanup: ERC 0 violations, netlist identical (107 components).
Co-Authored-By: Claude Fable 5 <noreply@anthropic.com>
Roflin
Dennis Brentjes